19 February 2003 Surface activated bonding for copper plate by excimer laser irradiation
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Proceedings Volume 4830, Third International Symposium on Laser Precision Microfabrication; (2003) https://doi.org/10.1117/12.486585
Event: LAMP 2002: International Congress on Laser Advanced Materials Processing, 2002, Osaka, Japan
Abstract
When a pair of clean solid surface are brought close to the atoms distance in the vacuum, the solids were bonded by the gravitation and binding force. Such a way of bonding is called a surface activated bonding. In this work, a laser irradiated to a couple of copper plates surface under various conditions of laser irradiation. The surface oxidation layer and organic layer were removed by laser ablation. After the irradiation, a couple of copper plates surface get close to each other. The possibility of the bonding was examined by AFM.
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Takashi Suzuki, Takao Araki, Minoru Nishida, "Surface activated bonding for copper plate by excimer laser irradiation", Proc. SPIE 4830, Third International Symposium on Laser Precision Microfabrication, (19 February 2003); doi: 10.1117/12.486585; https://doi.org/10.1117/12.486585
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