19 February 2003 Waterjet-guided laser processing
Author Affiliations +
Proceedings Volume 4830, Third International Symposium on Laser Precision Microfabrication; (2003); doi: 10.1117/12.486514
Event: LAMP 2002: International Congress on Laser Advanced Materials Processing, 2002, Osaka, Japan
Abstract
The waterjet-guided laser processing is a thermal cutting process in which the laser beam is used as the machine tool for cutting and the fine waterjet plays a role as an optical waveguide. The laser beam is guided in the waterjet stream with the full reflection that takes place at the boundary between water and air, in a manner similar to glass fibers. The waterjet also has the function of waveguiding and removing the cut products. The diameter of the waterjet can be controled between 50 and 200 μm. The diameter of laser beam is completely utilised. The useful length of waterjet is usually approximately 50 to 100 mm. The type of laser used is a pulsed Nd:YAG laser. The advantages of waterjet-guided laser processing are (1) no Z-axis control, (2) narrower cut widths down to 50 μm, (3) very small heat affected zone, (4) a little oxidation of the cut edges, and (5) no assist gas for cutting. A reseach was carried out for the new industrial application which is unsuitable by conventional laser cutting.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Bernold Richerzhagen, Muneharu Kutsuna, Haruhiku Okada, Takeshi Ikeda, "Waterjet-guided laser processing", Proc. SPIE 4830, Third International Symposium on Laser Precision Microfabrication, (19 February 2003); doi: 10.1117/12.486514; https://doi.org/10.1117/12.486514
PROCEEDINGS
4 PAGES


SHARE
KEYWORDS
Laser cutting

Laser processing

Semiconducting wafers

Diamond

Laser development

Optical fibers

Silicon

Back to Top