3 March 2003 Laser assisted generation of electronic circuits on tailored thermoplastics
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Proceedings Volume 4831, First International Symposium on High-Power Laser Macroprocessing; (2003) https://doi.org/10.1117/12.497590
Event: LAMP 2002: International Congress on Laser Advanced Materials Processing, 2002, Osaka, Japan
Abstract
This paper describes the tailoring of thermoplastics and the laser assisted generation of active regions that catalyze a chemical metal deposition in a liquid plating solution on these thermoplastics. The plated regions may serve as an electronic circuit on the insulating thermoplastic substrate. Tailoring of the thermoplastic materials is achieved by addition of a special activator powder. This powder consists of micro-encapsulated catalytic core particles with a non-catalytic barrier layer on their surface. Different encapsulation methods are compared for a copper core material. Laser activation is examined using a cw CO2 laser and an Nd:YAG laser. No activation is achieved with the CO2 laser. With the Nd:YAG laser and suitable process parameters, activation is possible even at writing speeds of up to 650 mm/s. A qualitative model is presented that explains the basic mechanisms of the laser activation process.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gerd Esser, Manfred Geiger, "Laser assisted generation of electronic circuits on tailored thermoplastics", Proc. SPIE 4831, First International Symposium on High-Power Laser Macroprocessing, (3 March 2003); doi: 10.1117/12.497590; https://doi.org/10.1117/12.497590
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