3 March 2003 Laser assisted generation of electronic circuits on tailored thermoplastics
Author Affiliations +
Proceedings Volume 4831, First International Symposium on High-Power Laser Macroprocessing; (2003) https://doi.org/10.1117/12.497590
Event: LAMP 2002: International Congress on Laser Advanced Materials Processing, 2002, Osaka, Japan
Abstract
This paper describes the tailoring of thermoplastics and the laser assisted generation of active regions that catalyze a chemical metal deposition in a liquid plating solution on these thermoplastics. The plated regions may serve as an electronic circuit on the insulating thermoplastic substrate. Tailoring of the thermoplastic materials is achieved by addition of a special activator powder. This powder consists of micro-encapsulated catalytic core particles with a non-catalytic barrier layer on their surface. Different encapsulation methods are compared for a copper core material. Laser activation is examined using a cw CO2 laser and an Nd:YAG laser. No activation is achieved with the CO2 laser. With the Nd:YAG laser and suitable process parameters, activation is possible even at writing speeds of up to 650 mm/s. A qualitative model is presented that explains the basic mechanisms of the laser activation process.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gerd Esser, Gerd Esser, Manfred Geiger, Manfred Geiger, } "Laser assisted generation of electronic circuits on tailored thermoplastics", Proc. SPIE 4831, First International Symposium on High-Power Laser Macroprocessing, (3 March 2003); doi: 10.1117/12.497590; https://doi.org/10.1117/12.497590
PROCEEDINGS
9 PAGES


SHARE
Back to Top