Application of moire interferometry to thermal strain analysis for electronics packaging

Zhaowei Zhong

doi:10.1117/12.474040

17 February 2003 Application of the moire interferometry to thermal strain analysis for electronics packaging

Zhaowei Zhong

Proceedings Volume 4833, Applications of Photonic Technology 5; (2003) https://doi.org/10.1117/12.474040
Event: Applications of Photonic Technology 5, 2002, Quebec City, Canada

Abstract

The moire interferometry has been used to investigate the strains induced by thermal loading in various electronics packages. The AFM scanning moire technique has also been utilized to measure the strains of electronics packages with an even better resolution. The advantages and disadvantages of the full field moire, the micro moire, and the AFM scanning moire techniques are compared.

Citation Download Citation

Zhaowei Zhong "Application of the moire interferometry to thermal strain analysis for electronics packaging", Proc. SPIE 4833, Applications of Photonic Technology 5, (17 February 2003); https://doi.org/10.1117/12.474040

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available