Active interposer technology for high-speed and low-cost chip-to-chip optical interconnects

Takashi Mikawa; Osamu Ibaragi; Manabu Bonkohara

doi:10.1117/12.475557

11 July 2002 Active interposer technology for high-speed and low-cost chip-to-chip optical interconnects

Takashi Mikawa, Osamu Ibaragi, Manabu Bonkohara

Proceedings Volume 4870, Active and Passive Optical Components for WDM Communications II; (2002) https://doi.org/10.1117/12.475557
Event: ITCom 2002: The Convergence of Information Technologies and Communications, 2002, Boston, MA, United States

Abstract

We have developed opto-electronic conversion module termed " active interposer" and polymeric waveguide film lamination technologies for optical interconnects between LSI chips. The fabricated active interposers are composed of VCSELs, MSM-PDs , submount and composed of Si circuits stacked via through-hole electrodes enabling high-performances. Also, waveguide film lamination technologies developed are capable of cost reductions. We present processing and test results of the fabricated optoelectronic devices suitable for 3D stacking as well as the high-speed transmission characteristics of the active interposers assembled on the PCB where polymeric waveguide film is lammated.

Citation Download Citation

Takashi Mikawa, Osamu Ibaragi, and Manabu Bonkohara "Active interposer technology for high-speed and low-cost chip-to-chip optical interconnects", Proc. SPIE 4870, Active and Passive Optical Components for WDM Communications II, (11 July 2002); https://doi.org/10.1117/12.475557

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