11 July 2002 Active interposer technology for high-speed and low-cost chip-to-chip optical interconnects
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Proceedings Volume 4870, Active and Passive Optical Components for WDM Communications II; (2002) https://doi.org/10.1117/12.475557
Event: ITCom 2002: The Convergence of Information Technologies and Communications, 2002, Boston, MA, United States
Abstract
We have developed opto-electronic conversion module termed " active interposer" and polymeric waveguide film lamination technologies for optical interconnects between LSI chips. The fabricated active interposers are composed of VCSELs, MSM-PDs , submount and composed of Si circuits stacked via through-hole electrodes enabling high-performances. Also, waveguide film lamination technologies developed are capable of cost reductions. We present processing and test results of the fabricated optoelectronic devices suitable for 3D stacking as well as the high-speed transmission characteristics of the active interposers assembled on the PCB where polymeric waveguide film is lammated.
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Takashi Mikawa, Takashi Mikawa, Osamu Ibaragi, Osamu Ibaragi, Manabu Bonkohara, Manabu Bonkohara, } "Active interposer technology for high-speed and low-cost chip-to-chip optical interconnects", Proc. SPIE 4870, Active and Passive Optical Components for WDM Communications II, (11 July 2002); doi: 10.1117/12.475557; https://doi.org/10.1117/12.475557
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