27 December 2002 Aerial image-based inspection of binary (OPC) and embedded-attenuated PSM
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The paper presents a revolutionary technology to inspect advanced contact layers. Instead of finding defects based on a size-dependent defect specification, defects are found according to their impact at the wafer CD result. The inspection methodology used is aerial imaging. The main advantage of this method is that only defects, which actually affect the wafer result, will be detected and classified. The paper presents first inspection results on contact layers designed for the 130nm and 90 nm technology node.
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Felix Chang, Felix Chang, Chang-Cheng Hung, Chang-Cheng Hung, John C.H. Lin, John C.H. Lin, Anja Rosenbusch, Anja Rosenbusch, Reuven Falah, Reuven Falah, Shirley Hemar, Shirley Hemar, } "Aerial image-based inspection of binary (OPC) and embedded-attenuated PSM", Proc. SPIE 4889, 22nd Annual BACUS Symposium on Photomask Technology, (27 December 2002); doi: 10.1117/12.467767; https://doi.org/10.1117/12.467767

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