18 October 2002 Three-dimensional vision sensor with multiple CCD cameras
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Proceedings Volume 4902, Optomechatronic Systems III; (2002) https://doi.org/10.1117/12.468381
Event: Optomechatronic Systems III, 2002, Stuttgart, Germany
Abstract
For the mountedprinted circuit board inspection, the inspection system is required to detect the 3-D position of the components. To detect the 3-D positions of components,a 3-D vision sensor with multiple CCD cameras has been introduced. The system executes the stereo image processing to measure the 3-D position of he objects. For the electric components, the expected position on he PCB boards can be defined. So, the method of stereo image processing is simplified. Only preparing a measuremen line on every component is enough to detect its position. To perform the stereo image processing on the line, Dynamic Programming can be applied to perform the stereo matching between the locally deformed two images. Introducing the DP method to the stereo matching,the experimental system has been proved its precise 3-D position detection ability.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Seiji Hata, Seiji Hata, Daisuke Shima, Daisuke Shima, Kan'ichi Kaida, Kan'ichi Kaida, } "Three-dimensional vision sensor with multiple CCD cameras", Proc. SPIE 4902, Optomechatronic Systems III, (18 October 2002); doi: 10.1117/12.468381; https://doi.org/10.1117/12.468381
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