Surface inspection of patterned wafer based on 2D wavelet transform

Mingtao Zhao; Leon Dumoulin

doi:10.1117/12.467632

18 October 2002 Surface inspection of patterned wafer based on 2D wavelet transform

Mingtao Zhao, Leon Dumoulin

Proceedings Volume 4902, Optomechatronic Systems III; (2002) https://doi.org/10.1117/12.467632
Event: Optomechatronic Systems III, 2002, Stuttgart, Germany

Abstract

Dark-filed imaging and template techniques are employed for on-line scratch inspection of 8-inch patterned wafer. Uneven optical-filed illumination caused by the imperfection of the lighting source, big field of view and unwanted reflection of local tiny sloping areas of inspected die, will result in many fake scratches. Discrete 2D wavelet positive and reconstruction transforms are introduced to preserve only authentic scratches. Integrated with image subtraction operation and gradient sorting of each defect, obvious and faint scratches can be effectively recognized.

Citation Download Citation

Mingtao Zhao and Leon Dumoulin "Surface inspection of patterned wafer based on 2D wavelet transform", Proc. SPIE 4902, Optomechatronic Systems III, (18 October 2002); https://doi.org/10.1117/12.467632

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