18 October 2002 Visual inspection PC system for quality control of electronic devices
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Proceedings Volume 4902, Optomechatronic Systems III; (2002) https://doi.org/10.1117/12.467256
Event: Optomechatronic Systems III, 2002, Stuttgart, Germany
We have been developing an image processing method for the automatic inspection of electronic devices and implemented it on PC. And this system was already fabricated in the real production line for collecting the practical performance. 2D edge detection method for evaluating the surface recognition of the printed circuit board was proposed so far, and the validity was clarified. In this paper the outline of this system is firstly explained and the performance of this system is reported in detail. However, since some defects appear at the top surface of the mold cannot be detected even with a set of this 2D inspection procedure, new 3-dimensional inspection of the flatness of the mold top surface was introduced. Depth from Focus Method was implemented in order to enforce this system to cope with 3-dimensional defects. An image processing method for evaluating the flatness of the face of the device is now developed by analyzing this 3D image. Affine transformation is employed here to reduce the geometric distortions inherent in the given images.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hiroyasu Koshimizu, Hiroyasu Koshimizu, Kazunori Takagi, Kazunori Takagi, Takashi Watanabe, Takashi Watanabe, "Visual inspection PC system for quality control of electronic devices", Proc. SPIE 4902, Optomechatronic Systems III, (18 October 2002); doi: 10.1117/12.467256; https://doi.org/10.1117/12.467256


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