12 September 2002 Laser micromachining in the microelectronics industry
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The use of lasers in microelectronics production for trimming, link cutting, ablating, drilling and general “micromachining” continues to grow. Several new technologies, such as alternative wavelength processing and shaped, uniform laser spots have produced better processing quality, higher reliability, and greater yields. This paper will review the latest technologies of laser micro-machining in microelectronics. Laser drilling for printed circuit board will be dressed in another paper.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yunlong Sun, Yunlong Sun, Edward J. Swenson, Edward J. Swenson, } "Laser micromachining in the microelectronics industry", Proc. SPIE 4915, Lasers in Material Processing and Manufacturing, (12 September 2002); doi: 10.1117/12.482886; https://doi.org/10.1117/12.482886

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