Research and fabrication of integrated optical chip of hybrid-integrated optical acceleration seismic geophone

Caihe Chen; Bo Wu; Guilan Ding; Yuming Cui

doi:10.1117/12.470943

20 September 2002 Research and fabrication on integrated optical chip of hybrid-integrated optical acceleration seismic geophone

Caihe Chen, Bo Wu, Guilan Ding, Yuming Cui

Author Affiliations +

Proceedings Volume 4919, Advanced Materials and Devices for Sensing and Imaging; (2002) https://doi.org/10.1117/12.470943
Event: Photonics Asia, 2002, Shanghai, China

Abstract

The hybrid-integrated optical acceleration seismic geophone is present for the first time in this paper. Double-Y branching guide, phase modulator and polarizers, which are integrated on the LiNbO₃ substrate to constitute the Michelson interference chip, hardcore of the accelerometer, are analyzed and designed respectively. The chip is fabricated successfully and the lighting test is proceeding to check the quality of the chip. The waveguides' images of chip fabricated is presented. The results of and lighting test are given too.

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Caihe Chen, Bo Wu, Guilan Ding, and Yuming Cui "Research and fabrication on integrated optical chip of hybrid-integrated optical acceleration seismic geophone", Proc. SPIE 4919, Advanced Materials and Devices for Sensing and Imaging, (20 September 2002); https://doi.org/10.1117/12.470943

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