10 September 2002 Design and simulation of a bulk micromachined relay with lateral contact
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Proceedings Volume 4928, MEMS/MOEMS Technologies and Applications; (2002); doi: 10.1117/12.483185
Event: Photonics Asia, 2002, Shanghai, China
Abstract
A bulk micromachined relay with lateral contact structure is presented in this paper. The relay is fabricated with glass/silicon wafer bonding and deep reactive ion etching (DRIE) process. it is laterally driven with electrostatic actuator. The threshold voltage of the relay is simulated using Reduced Order Modeling (ROM) methods provided by a general finite element simulator, ANSYSTM. The simulated result and experimental result are compared and discussed
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Zhenchuan Yang, Zhihong Li, Yilong Hao, Guoying Wu, "Design and simulation of a bulk micromachined relay with lateral contact", Proc. SPIE 4928, MEMS/MOEMS Technologies and Applications, (10 September 2002); doi: 10.1117/12.483185; https://doi.org/10.1117/12.483185
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KEYWORDS
Relays

Microrelays

Electrodes

Etching

Semiconducting wafers

Wafer bonding

Chemical elements

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