10 September 2002 New test structure for measuring thermal conductivity of polysilicon thin films
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Abstract
This paper introduces a new test structure for thermal conductivity of poly-silicon thin films, and analyzes the feature ofthe measurement structure, modeling and measurement methods. The structure was fabricated by using surface micromachining process for vacuum encapsulation fabrication, while post- processing bulk silicon micromachining is not essential.
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Gaobin Xu, Gaobin Xu, Qing-An Huang, Qing-An Huang, Yanfeng Jiang, Yanfeng Jiang, } "New test structure for measuring thermal conductivity of polysilicon thin films", Proc. SPIE 4928, MEMS/MOEMS Technologies and Applications, (10 September 2002); doi: 10.1117/12.483184; https://doi.org/10.1117/12.483184
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