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27 May 2003 Characteristics of imaging fibre bundles for use in an ESPI-based instrument for distributed high-resolution measurements
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Proceedings Volume 4933, Speckle Metrology 2003; (2003)
Event: Speckle Metrology 2003, 2003, Trondheim, Norway
A laboratory measurement system based on electronic speckle pattern interferometry is described which is intended to measure the deformation fields developed in Ball Grid Arrays (BGAs) and other high density electronic packages and interfaces under thermal load associated with production and normal use. The die and substrate generally have widely differing coefficients of thermal expansion, which results both in residual stress in the assembly on cooling and stress during operation cycles. The instrument currently under development at EMPA uses a NIR laser diode source to illuminate the device under test. The instrument involves edge-on illumination of the outer row of solder balls fo a BGA. A novel imaging scheme is employed with a linear array of coherent fiber bundles being used to transfer the images of the individual solder balls to the object plane of the camera. We report on the tests we have performed on different types of bundles, both flexible and rigid, to evaluate the characteristics for optimum image quality in optical setups relevant to our micro-imaging ESPI-application: modulation transfer function (MTF), limiting resolution, cross-talk between adjacent fibers, optical transmission quality. We report first fringe phase maps taken with the ESPI setup.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Erwin K. Hack, Peter Dias-Lalcaca, and Urs J. Sennhauser "Characteristics of imaging fibre bundles for use in an ESPI-based instrument for distributed high-resolution measurements", Proc. SPIE 4933, Speckle Metrology 2003, (27 May 2003);


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