27 May 2003 Low-coherence speckle interferometer (LCSI) for characterization of adhesion in adhesive-bonded joints
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Proceedings Volume 4933, Speckle Metrology 2003; (2003) https://doi.org/10.1117/12.516577
Event: Speckle Metrology 2003, 2003, Trondheim, Norway
Abstract
Low Coherence Speckle Interferometry (LCSI) combines the depth-resolved measurement of Low Coherence Interferometry (LCI) with the high-accuracy deformation measurement of Electronic Speckle Pattern Interferometry (ESPI). Depth-resolved deformation measurement enables the characterization of the behavior of interfaces in multi-layer materials or structures while changing the ambient conditions. In this paper LCSI is introduced as a new tool for characterization of adhesion. The experimental set-up and the principle of work are described. A FEM-model of an adhesive bonded aluminum joint is developed to analyze the behavior of the Al-adhesive interface during mechanical testing. Some recent results are shown. This application demand measurements on a microscopic scale (camera field of view down to 500 x 500 μm).
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Kay Gastinger, Kay Gastinger, Svein Winther, Svein Winther, Klaus D. Hinsch, Klaus D. Hinsch, } "Low-coherence speckle interferometer (LCSI) for characterization of adhesion in adhesive-bonded joints", Proc. SPIE 4933, Speckle Metrology 2003, (27 May 2003); doi: 10.1117/12.516577; https://doi.org/10.1117/12.516577
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