14 November 2002 Laser-LIGA for Ni microcantilevers
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Abstract
This paper presents our design and experimental results of nickel microcantilevers, which were fabricated using a laser-LIGA process, based on KrF (248 nm) excimer laser micromachining. A chrome-on-quartz mask, containing the desired mask patterns was prepared for this work. The substrate of copper (30 μm thick) clad printed circuit board (PCB) was laminated with Laminar 5038 photopolymer to be laser patterned. Following laser patterning and laser cleaning, all the samples were electroformed with nickel on top of the copper layer. To release the Ni microcantilevers, the excimer laser was employed again to remove the polymer in the localised area to facilitate Cu selective etching. Here, copper acted as the sacrificial layer as well. The Cu selective etching was carried out with ~ 20 % (wt) aqueous solution of ammonium persulfate. Because the Cu selective etching is isotropic, some undercuts happened next to the anchor area. The samples were characterised using optical microscope, confocal laser scanning microscope and SEM, and some of Ni cantilevers were tested electro-thermally. Their performance was analyzed with respect to the simulation results.
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Hengyi Jin, Hengyi Jin, Erol C. Harvey, Erol C. Harvey, Jason P. Hayes, Jason P. Hayes, Muralidhar K. Ghantasala, Muralidhar K. Ghantasala, Yao Fu, Yao Fu, Karlo Jolic, Karlo Jolic, Matthew Solomon, Matthew Solomon, Kynan Graves, Kynan Graves, } "Laser-LIGA for Ni microcantilevers", Proc. SPIE 4935, Smart Structures, Devices, and Systems, (14 November 2002); doi: 10.1117/12.476113; https://doi.org/10.1117/12.476113
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