Translator Disclaimer
15 April 2003 Fabricating VCSELs in a high-tech start-up
Author Affiliations +
Proceedings Volume 4942, VCSELs and Optical Interconnects; (2003) https://doi.org/10.1117/12.476220
Event: Photonics Fabrication Europe, 2002, Bruges, Belgium
Abstract
U-L-M photonics GmbH has been set up to develop next-generation vertical-cavity surface-emitting laser (VCSEL) products and to exploit the full potential of these industry-leading devices in terms of performance and application areas. Reliability is important for all application areas for VCSELs. This paper presents the excellent reliability characteristics of U-L-M’s VCSEL technology. Accumulation of all advantageous properties VCSELs are famous for, like low power consumption, circular low divergent beam profile, high modulation bandwidth, and scalability of monolithic arrangements, results in two-dimensional (2D) VCSEL arrays that appear as key components to reach highest aggregate bandwidths of tomorrow’s parallel optical transceivers. We report on 2D VCSEL arrays, substrate emitting although operating at 850 nm and prepared for flip-chip bonding, that are well suited for the customer’s needs in terms of speed, power consumption, and compact integration. Up to now, in most single channel transceivers, the VCSEL is packaged in a TO can and connected to the driver via a printed circuit board. We investigate the performance of a high speed VCSEL in a TO 46 package and demonstrate 10 Gbps transmission. The potential of VCSEL technology in other areas of application than datacom or telecom is just going to be exploited. We present a 760 nm single-mode VCSELs for gas monitoring applications.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Martin Grabherr, Roland Jaeger, Roger King, Burghard Schneider, and Dieter Wiedenmann "Fabricating VCSELs in a high-tech start-up", Proc. SPIE 4942, VCSELs and Optical Interconnects, (15 April 2003); https://doi.org/10.1117/12.476220
PROCEEDINGS
12 PAGES


SHARE
Advertisement
Advertisement
RELATED CONTENT

28 Gb/s 850 nm oxide VCSEL development at Avago
Proceedings of SPIE (March 12 2013)
VCSELs as light source for time-of-flight sensors
Proceedings of SPIE (February 24 2017)
120 Gbps VCSEL arrays: fabrication and quality aspects
Proceedings of SPIE (February 05 2010)
Cryogenic characterization of low-cost Joule-Thomson coolers
Proceedings of SPIE (December 14 2000)
Speed it up to 10 Gb s and flip chip...
Proceedings of SPIE (June 03 2002)
Emerging VCSEL technologies at Finisar
Proceedings of SPIE (February 05 2010)

Back to Top