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15 April 2003 High-density interleaved VCSEL-RCPD arrays for optical information processing
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Proceedings Volume 4942, VCSELs and Optical Interconnects; (2003) https://doi.org/10.1117/12.476226
Event: Photonics Fabrication Europe, 2002, Bruges, Belgium
Abstract
Vertical-cavity surface-emitting lasers (VCSELs) are uniquely suited for massively parallel interconnects and scannerless imaging applications due to their small size, high efficiency and amiability to formation of high-density 2-dimensional arrays. We have successfully fabricated 4096 element arrays (64×64) containing alternating rows of selectively-oxidized 850 nm VCSELs and resonant-cavity photodetectors (RCPDs) on a 55 micron pitch monolithically integrated on semi-insulating GaAs substrates. We employ a matrix addressable architecture to reduce the input and output electrical connections to the array, where all the VCSELs (or RCPDs) in each row are connected by a common metal trace at the base of their mesas. The columns are connected by metal traces that bridge from mesa top to mesa top, connecting every other row (i.e., only VCSELs or only RCPDs). The design, fabrication and performance of these arrays is discussed.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kent M. Geib, Darwin K. Serkland, Andrew A. Allerman, Terry W. Hargett, and Kent D. Choquette "High-density interleaved VCSEL-RCPD arrays for optical information processing", Proc. SPIE 4942, VCSELs and Optical Interconnects, (15 April 2003); https://doi.org/10.1117/12.476226
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