15 April 2003 Increasing the functionality of free-space micro-optical intrachip modules with DOEs: towards reconfigurable photonic interconnects
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Proceedings Volume 4942, VCSELs and Optical Interconnects; (2003) https://doi.org/10.1117/12.477272
Event: Photonics Fabrication Europe, 2002, Bruges, Belgium
Abstract
We study the potentialities of three dimensional micro-optical pathway blocks combining refractive microlens arrays, reflective micro-prisms and diffractive fan-out elements, to enhance the functionalities of short-distance intra-chip optical interconnects. As an example, we demonstrate the possibility to enhance the point-to-point interconnection functionality to that of broadcasting data over a chip. We also investigate the limitations imposed by the physical dimensions of the refractive and diffractive micro-optical components. We then illustrate this example by a quantitatively elaborated design of a fan-out element from a VCSEL array to a detector array with a 1 to 9 signal broadcasting for every source. Furthermore we show that with the use of DOE’s we can achieve a broadcasting functionality that can lead towards reconfigurable optical interconnects, with the aid of wavelength sensitive resonant cavity detectors and WDM-inspired interconnection schemes.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lieven Desmet, Arkadiusz Sagan, Wojciech Grabowski, Ryszard Buczynski, Hugo Thienpont, "Increasing the functionality of free-space micro-optical intrachip modules with DOEs: towards reconfigurable photonic interconnects", Proc. SPIE 4942, VCSELs and Optical Interconnects, (15 April 2003); doi: 10.1117/12.477272; https://doi.org/10.1117/12.477272
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