3 April 2003 Optical surface analysis: a new technique for the inspection and metrology of optoelectronic films and wafers
Author Affiliations +
Abstract
In response to demand for higher volumes and greater product capability, integrated optoelectronic device processing is rapidly increasing in complexity, benefiting from techniques developed for conventional silicon integrated circuit processing. The needs for high product yield and low manufacturing cost are also similar to the silicon wafer processing industry. This paper discusses the design and use of an automated inspection instrument called the Optical Surface Analyzer (OSA) to evaluate two critical production issues in optoelectronic device manufacturing: (1) film thickness uniformity, and (2) defectivity at various process steps. The OSA measurement instrument is better suited to photonics process development than most equipment developed for conventional silicon wafer processing in two important ways: it can handle both transparent and opaque substrates (unlike most inspection and metrology tools), and it is a full-wafer inspection method that captures defects and film variations over the entire substrate surface (unlike most film thickness measurement tools). Measurement examples will be provided in the paper for a variety of films and substrates used for optoelectronics manufacturing.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Laurie Bechtler, Vamsi Velidandla, "Optical surface analysis: a new technique for the inspection and metrology of optoelectronic films and wafers", Proc. SPIE 4944, Integrated Optical Devices: Fabrication and Testing, (3 April 2003); doi: 10.1117/12.468295; https://doi.org/10.1117/12.468295
PROCEEDINGS
8 PAGES


SHARE
RELATED CONTENT


Back to Top