25 March 2003 Highly thermally conductive substrates with adjustable CTE for diode laser bar packaging
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Abstract
The design of a novel mounting substrate for high power diode laser bars is presented. This substrate is combining the high thermal conductivity of diamond with the property of being able to adjust its coefficient of thermal expansion (CTE) to that of the laser material GaAs. Such a unique feature has become possible by attributing to the hard material diamond an artificial ductility by laser cutting of stress relieving openings in the diamond substrates. Combining two of these substrates in a sandwich with a middle layer of copper, one is able to realize a desired CTE just by choosing the right copper layer thickness. Based on the results of 3D-FEM calculations, some of these diamond-copper-diamond substrates have been produced with different copper thicknesses. The technique of electronic speckle pattern interferometry (ESPI) has been employed to measure the average CTE of these substrates. For diamond thicknesses of 0,3 mm, a copper foil thickness of 0,05 mm enabled a CTE-match with GaAs. A nearly stress free state in the laser bars mounted on these substrates has been demonstrated by photocurrent spectroscopy.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dirk Lorenzen, Dirk Lorenzen, Petra Hennig, Petra Hennig, } "Highly thermally conductive substrates with adjustable CTE for diode laser bar packaging", Proc. SPIE 4945, MEMS/MOEMS: Advances in Photonic Communications, Sensing, Metrology, Packaging and Assembly, (25 March 2003); doi: 10.1117/12.468639; https://doi.org/10.1117/12.468639
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