19 June 2003 Investigation of indium solder interfaces for high-power diode lasers
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Proceedings Volume 4973, High-Power Diode Laser Technology and Applications; (2003) https://doi.org/10.1117/12.478370
Event: High-Power Lasers and Applications, 2003, San Jose, CA, United States
In order to optimize the soldering process of laserbars onto heatsinks with Indium solder, several investigations have been made. First the growth of Indium oxide film is examined. With this knowledge four different reduction materials are selected. Formic acid as a wet chemical reduction, a plasma activated Hydrogen/Argon gas, a gas enriched with formic acid, and a protective layer of Gold were investigated and compared for an optimized reduction of the oxide film of the Indium solder. A cross section of the solder interface after the soldering process is made in order to see the distribution of the metals. High diffusion of the solder with its contact partners is a sign of a good connection. Enough pure Indium has to be available after the soldering process in order to use its creek properties to reduce the mechanical stress in the laserbar.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Christian Scholz, Christian Scholz, Konstantin Boucke, Konstantin Boucke, Reinhart Poprawe, Reinhart Poprawe, "Investigation of indium solder interfaces for high-power diode lasers", Proc. SPIE 4973, High-Power Diode Laser Technology and Applications, (19 June 2003); doi: 10.1117/12.478370; https://doi.org/10.1117/12.478370


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