Laser processing of ceramic and crystalline wafer substrates for microelectronic applications

David Ashkenasi; Alexander Binder; Houssam Jaber; Holger Kern; Norbert Mueller; Andreas Ziegert

doi:10.1117/12.479234

17 October 2003 Laser processing of ceramic and crystalline wafer substrates for microelectronic applications

David Ashkenasi, Alexander Binder, Houssam Jaber, Holger Kern, Norbert Mueller, Andreas Ziegert

Proceedings Volume 4977, Photon Processing in Microelectronics and Photonics II; (2003) https://doi.org/10.1117/12.479234
Event: High-Power Lasers and Applications, 2003, San Jose, CA, United States

Abstract

Ceramic and crystalline wafer substrates are widely used in microelectronics. The individual choice is based on their thermal, optical and mechanical properties. For a variety of applications high quality laser micro processing of these materials, i.e. the generation of blind and through holes, grooves and even complex three dimensional micro structures, is gaining in importance. The department of applied laser technologies of the LMTB GmbH has conducted extensive studies on the versatility of q-switch Nd:YAG laser systems for the micro structuring of ceramic and crystalline wafer substrates that differ strongly in their optical and mechanical properties, such as Al₂O₃, AlN, sapphire, Si and SiC. This paper discusses the laser material micro machining results in respect to the laser parameters used to optimize the micro processing quality and speed for the different materials.

Citation Download Citation

David Ashkenasi, Alexander Binder, Houssam Jaber, Holger Kern, Norbert Mueller, and Andreas Ziegert "Laser processing of ceramic and crystalline wafer substrates for microelectronic applications", Proc. SPIE 4977, Photon Processing in Microelectronics and Photonics II, (17 October 2003); https://doi.org/10.1117/12.479234

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