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17 October 2003 Novel beam delivery system for microvia drilling using holographic and refractive optics
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Proceedings Volume 4977, Photon Processing in Microelectronics and Photonics II; (2003) https://doi.org/10.1117/12.472854
Event: High-Power Lasers and Applications, 2003, San Jose, CA, United States
Abstract
The research and development of the optical system described was due in part to the virtual stalemate of current microvia dirlling technology within the High Density Interconnect market. The desire by industry to acquire faster processes for drilling microvias led to our research in the utilization of hybrid optical systems, where standard refractive and computer generated diffractive optics could be meshed to create a system that would out perform the current technology in the marketplace. The outcome of this work is covered in the following paper and will, at the outset, briefly cover the targeted market segment for which the beam delivery system was developed, as well as its general capabilities. The paper will cover the basic architecture and technology behind the laser optical beam delivery system, as well as the unique components that make up the assembly. Each of the optical elements within the system will be briefly described, and the CGH elements will be briefly explained, including a description of the software used. The laser beam characteristics at several points along the beam delivery will be discussed, as well as the final image formed at the target plane where the microvia is drilled. Specific performance details will be shared with regards to component efficiency, i.e. diffraction efficiency losses, as well as total system performance throughout the beam line. The final section will cover materials processing, including the remarkable process rate increases and microvia hole quality achieved.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Todd E. Lizotte and Orest P. Ohar "Novel beam delivery system for microvia drilling using holographic and refractive optics", Proc. SPIE 4977, Photon Processing in Microelectronics and Photonics II, (17 October 2003); https://doi.org/10.1117/12.472854
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