17 October 2003 Ultrashort-pulse laser micromachining testbed development
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Proceedings Volume 4977, Photon Processing in Microelectronics and Photonics II; (2003) https://doi.org/10.1117/12.479225
Event: High-Power Lasers and Applications, 2003, San Jose, CA, United States
Ultrashort pulse or femtosecond laser materials processing is an emerging technology that potentially can produce substantial cost savings in the manufacture of a wide variety of Navy systems. A laser micromachining testbed facility utilizing two industrial laser systems, a Ti:Sapphire laser capable of producing pulses of less than 150 femtoseconds and a frequency tripled Nd:YLF laser (351 nm, approximately 50 nsec pulsewidth) has been established at the Electro Optics Center (EOC). The testbed provides the EOC with a facility for feasibility testing of laser micromachining applications and a resource for workforce training. In addition, the testbed provides a unique capability of evaluating ultrashort [150 fs, long wavelength (775 nm)] pulses versus longer pulse, short wavelength (351 nm), high photon energy pulses for micromachining applications. Comparison of processing by the femtosecond and uv solid state laser will reveal the optimal processing for an intended application where throughput, stability and quality of the process can be assessed.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jeff G. Thomas, Jeff G. Thomas, J. T. Schriempf, J. T. Schriempf, Randy Gilmore, Randy Gilmore, } "Ultrashort-pulse laser micromachining testbed development", Proc. SPIE 4977, Photon Processing in Microelectronics and Photonics II, (17 October 2003); doi: 10.1117/12.479225; https://doi.org/10.1117/12.479225

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