16 January 2003 MEMS packaging efforts at Sandia National Laboratories
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Proceedings Volume 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II; (2003) https://doi.org/10.1117/12.476331
Event: Micromachining and Microfabrication, 2003, San Jose, CA, United States
Sandia National Laboratories has programs covering a broad range of MEMS technologies from LIGA to bulk to surface micromachining. These MEMS technologies are being considered for an equally broad range of applications, including sensors, actuators, optics, and microfluidics. As these technologies have moved from the research to the prototype product stage, packaging has been required to develop new capabilities to integrated MEMS and other technologies into functional microsystems. This paper discusses several of Sandia’s MEMS packaging efforts, focusing mainly on inserting Sandia’s SUMMiT V (5-level polysilicon) surface micromachining technology into fieldable microsystems.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jonathan S. Custer, Jonathan S. Custer, } "MEMS packaging efforts at Sandia National Laboratories", Proc. SPIE 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II, (16 January 2003); doi: 10.1117/12.476331; https://doi.org/10.1117/12.476331

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