16 January 2003 Reliability evaluation of thermally actuated micromachined relays for space applications
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Proceedings Volume 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II; (2003) https://doi.org/10.1117/12.472726
Event: Micromachining and Microfabrication, 2003, San Jose, CA, United States
Abstract
This paper reports results on electrical characteristics, evaluation of design, and reliability of the first commercially available micromachined relays. The parts have been characterized in a wide range of temperatures (from 100 degrees C to +180 degrees C) and load conditions (voltages from 10 V to 70 V and currents from 5 mA to 200 mA). Mechanical integrity of the parts has been evaluated by subjecting them to multiple mechanical shocks in the range from 100 G to 1000 G up to 10,000 shocks. Life testing was performed at different contact voltages and current loads during 108 switching cycles. To simulate space operation conditions, characteristics of the parts were monitored during vacuum testing. Typical failure modes associated with different test conditions are discussed.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alexander Teverovsky, A. K. Sharma, "Reliability evaluation of thermally actuated micromachined relays for space applications", Proc. SPIE 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II, (16 January 2003); doi: 10.1117/12.472726; https://doi.org/10.1117/12.472726
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