16 January 2003 Solder bonding for microelectricalmechanical systems (MEMS) applications
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Proceedings Volume 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II; (2003) https://doi.org/10.1117/12.478202
Event: Micromachining and Microfabrication, 2003, San Jose, CA, United States
MEMS fabrication and packaging requires a bonding technology that is universal for all substrates, has high resolution, requires relatively lower temperatures, is reliable and is low cost to implement. The bonding technology presented meets the above standards. The process is substrate independent and involves aligned bonding of two similarly patterned wafers using tin solder as the bonding material. The technique can be used for whole wafer or selected area bonding. The resolution of this technique is only limited by the resolution that can be achieved in the patterning and delineation of the seed metal.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Abhijat Goyal, Abhijat Goyal, Srinivas Tadigadapa, Srinivas Tadigadapa, Rafiqul Islam, Rafiqul Islam, } "Solder bonding for microelectricalmechanical systems (MEMS) applications", Proc. SPIE 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II, (16 January 2003); doi: 10.1117/12.478202; https://doi.org/10.1117/12.478202

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