16 January 2003 Thermal stability of SU-8 fabricated microstructures as a function of photo initiator and exposure doses
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Proceedings Volume 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II; (2003) https://doi.org/10.1117/12.478197
Event: Micromachining and Microfabrication, 2003, San Jose, CA, United States
Abstract
SU-8 has been used directly as structural material for MEMS/BioMEMS components as well as optical MEMS components. Although the applications of SU-8 photoresist have widely been presented, the material properties and behavior at elevated temperature have rarely been reported. In this paper, the thermal stability of the SU-8 structures as the function of exposure doses and photo initiator concentration changes has been studied. Differential Scanning Calorimeter (DSC), Thermogravimetric Analyzer (TGA) and Dynamic mechanical analysis (DMA) are employed to study the thermal stabilities of exposed SU-8 microstructures. Mass loss as the function of exposure doses and post-baking time were studied by TGA. The results show that the relative mass loss is inversely proportional to the exposure dose as well as the post-baking time, which also directly affect the thermal stability of SU-8 components. The DSC results reveal that there is a phase change reaction occurs around the temperature of 150°C and is directly related to the photo initiator. The effects of this phase change on the tensile strength and creep behavior of SU-8 fabricated microstructures were also explored using DMA. These results will provide the MEMS researchers and engineers with the usable information in SU-8 applications. At the end, how to optimize SU-8 processing parameters to increase its thermal stability is discussed.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kun Lian, Zhong-geng Ling, Changgeng Liu, "Thermal stability of SU-8 fabricated microstructures as a function of photo initiator and exposure doses", Proc. SPIE 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II, (16 January 2003); doi: 10.1117/12.478197; https://doi.org/10.1117/12.478197
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