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16 January 2003 Nonassembled planar electrostatic micro-relay
Nikolay Ivanovich Mukhurov; Georgy I. Efremov; Vyacheslav Kovalevsky
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Proceedings Volume 4981, MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication II; (2003) https://doi.org/10.1117/12.480767
Event: Micromachining and Microfabrication, 2003, San Jose, CA, United States
Abstract
The developed and fabricated model of III-shaped non-assembled planar micro-relay is formed of aluminium anodic oxide, which possesses of high electromechanical properties. Film electrodes are formed using local plasma deposition for metallization of corresponding parts. Small-cells structure of the oxide together with photolithography and electrochemical treatment guarantees precision formation of slots and branches sizes, as well as perpendicularity of their walls relative to the substrate plane. The main sizes of the model are: width of the anchor is 60 μm, thickness of the anchor equal inter-electrodes gap is 14 μm, length of electrode is 1000 μm, inter-electrodes gap is 12 μm, active area of the micro-relay is 1,4 mm2. Planar design along with the micro-relay parameters enhancement simplify and shorten technological process, eliminate assembling, lower laboriousness and spoilage.
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Nikolay Ivanovich Mukhurov, Georgy I. Efremov, and Vyacheslav Kovalevsky "Nonassembled planar electrostatic micro-relay", Proc. SPIE 4981, MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication II, (16 January 2003); https://doi.org/10.1117/12.480767
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