Paper
21 January 2003 Development of 1×4 micro optical switch based on SOI vertical micromirror technology
Zhenfeng P. Wang, Xue Chuan Shan, Zhiping Wang, Wenqing Cao, Jianfeng Xu, Siak-Piang Lim, Wilfried Noell, Nico F. de Rooij
Author Affiliations +
Proceedings Volume 4983, MOEMS and Miniaturized Systems III; (2003) https://doi.org/10.1117/12.472787
Event: Micromachining and Microfabrication, 2003, San Jose, CA, United States
Abstract
In this paper, the development of a 1X4 micro optical switch utilizing electrostatic actuation and vertical silicon mirrors was reported. This device was fabricated from silicon-on-insulator (SOI) wafer using a bulk micromachining process, which allowed the fabrication of vertical mirrors and U-grooves through deep reactive ion etching (DRIE) of silicon. A few process steps were required in the fabrication. Moreover, the device was patterned in a single lithographic step. A relatively high yield (up to 70%) was achieved during the microfabrication due to this compact process flow. More importantly, the footprint was less than 13mm2. To verify the design, the stress/strain distribution around the actuator was examined using FEM simulation. The relationship between driving voltage and mirror displacement derived from simulation agreed well with the measurement. Tapered lensed singlemode fiber were assembled into U-grooves and positioned passively by fiber stopper. The device was then packaged and pigtailed. Characterization on the mechanical and optical performance of this device show the promising characteristics of this 1×4 optical switch for use in optical networks.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Zhenfeng P. Wang, Xue Chuan Shan, Zhiping Wang, Wenqing Cao, Jianfeng Xu, Siak-Piang Lim, Wilfried Noell, and Nico F. de Rooij "Development of 1×4 micro optical switch based on SOI vertical micromirror technology", Proc. SPIE 4983, MOEMS and Miniaturized Systems III, (21 January 2003); https://doi.org/10.1117/12.472787
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KEYWORDS
Mirrors

Switches

Optical switching

Actuators

Packaging

Deep reactive ion etching

Silicon

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