21 January 2003 Measurement of thermal-mechanical noise in MEMS microstructures
Author Affiliations +
Proceedings Volume 4983, MOEMS and Miniaturized Systems III; (2003) https://doi.org/10.1117/12.472753
Event: Micromachining and Microfabrication, 2003, San Jose, CA, United States
We report absolute measurements of thermal-mechanical noise in microelectromechanical systems. The measurements are made possible with a simple, high resolution optical technique that has a displacement resolution on the order of hundreds of femtometers per root Hz at frequencies of tens of kHz. The measured noise spectrum agrees with the calculated noise level to within 25%, a discrepancy most likely due to uncertainty in the effective dynamic mass of the vibrating bridge. These measurements demonstrate that thermal-mechanical noise can be the dominant noise source in actuated microelectromechanical devices. This noise will become even more pronounced as the size of mechanical devices continues to shrink.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Todd H. Stievater, Todd H. Stievater, William S. Rabinovich, William S. Rabinovich, Harvey S. Newman, Harvey S. Newman, Rita Mahon, Rita Mahon, Peter G. Goetz, Peter G. Goetz, Jack L. Ebel, Jack L. Ebel, David J. McGee, David J. McGee, } "Measurement of thermal-mechanical noise in MEMS microstructures", Proc. SPIE 4983, MOEMS and Miniaturized Systems III, (21 January 2003); doi: 10.1117/12.472753; https://doi.org/10.1117/12.472753


Back to Top