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14 July 2003 Fluorinated polyimide film replicated using SiO2 mold for fabrication of waveguide
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Proceedings Volume 4991, Organic Photonic Materials and Devices V; (2003) https://doi.org/10.1117/12.475450
Event: Integrated Optoelectronics Devices, 2003, San Jose, CA, United States
Abstract
A replication process using a SiO2 mold was demonstrated using a fluorinated polyimide. The replicated fluorinated polyimide film was separated from the mold by soaking in distilled water. The film separation with slow and then successive fast steps was due to the displacment of the weak adhesive layer by water and release of stress at the interface, respectively. Lowering the curing temperature of the fluorinated polyimide, whcih formed the weak adhesive layer at the interface, improved separation without chipping of the stripes of the SiO2 mold.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tsuyoshi Shioda "Fluorinated polyimide film replicated using SiO2 mold for fabrication of waveguide", Proc. SPIE 4991, Organic Photonic Materials and Devices V, (14 July 2003); https://doi.org/10.1117/12.475450
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