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30 May 2003 Fabrication of low-loss optical waveguides using a novel photosensitive polyimide
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Proceedings Volume 4997, Photonics Packaging and Integration III; (2003) https://doi.org/10.1117/12.475449
Event: Integrated Optoelectronics Devices, 2003, San Jose, CA, United States
Abstract
Fabrication of optical waveguides by a simple patterning process using photosensitive polyimide (PSPI) is described. Light waveguide based on PSPI was fabricated by photolithographic processing without use of dry etching process. The PSPI varnish is comprised of polyamic acid (PAA) which was made from fluorinated diamine and fluorinated tetracarboxylic dianhydride, and photosensitizer. The PSPI has the following characteristics: glass transition temperature (Tg) of 330 °C, coefficient of thermal expansion of 40 ppm/K. Moreover the PSPI is colorless, and posses low absorption at 1 .3 and 1 .55im. The sidewalls and the surfaces ofthe fabricated waveguide are very smooth, which is essential for the low loss optical mode propagation and lower scattering of the mode due to the imperfections. Single and multimode buried ridge waveguides on quartz glass substrate were fabricated and tested. Optical propagation losses were measured by standard cut back method and found to be as low as 0.4 dB/cm @ 1.55 jim. This fabrication process would be expected to contribute to low cost production for high performance opto-electronic devices.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kazunori Mune, Ryusuke Naito, Takashi Fukuoka, Amane Mochizuki, Kenji Matsumoto, Nasuhi Yurt, Gerald R. Meredith, Ghassan E. Jabbour, and Nasser Peyghambarian "Fabrication of low-loss optical waveguides using a novel photosensitive polyimide", Proc. SPIE 4997, Photonics Packaging and Integration III, (30 May 2003); https://doi.org/10.1117/12.475449
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