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30 May 2003 Photonic switching network with VCSEL array packaging for parallel multiprocessor cluster system
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Proceedings Volume 4997, Photonics Packaging and Integration III; (2003) https://doi.org/10.1117/12.475466
Event: Integrated Optoelectronics Devices, 2003, San Jose, CA, United States
Abstract
A novel photonic switching network with vertical cavity surface emitting laser (VCSEL) array packaging for parallel multiprocessor cluster system is described. The parallel multiprocessor cluster system provides 64 serve nodes connected by photonic switching network with parallel optical links. There are eight cluster subsystems in the system. Each subsystem includes eight computing nodes and an optical interconnect backplane of 8x8 crossbar optical interconnection network with VCSEL-based optoelectronic I/O parallel interface. Every I/O parallel interface between optical interconnection network and every computing node includes 16 VCSEL emitter pixels, 16 PIN receiver pixels. In order to couple 16 signal light beam array into optical fiber array ribbon, a fabrication technique based on the high precise position slot is used for assembling optical fiber array interface. A packaging structure for optical fiber array interface is presented. As the position slots of optical fiber array interface are formed by VLSI photolithography and IcP etch techniques, and etching depth is smaller compared with V-groove slot, the high precision slots with 25Ojtm pitch can be obtained. A configuration of coupling packaging for 16 VCSEL pixel array to 16 fiber array with 45° end surface is also presented in this paper.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Fengguang Luo, Mingcui Cao, Xinjun Zhou, Zhixiang Luo, and Jun Xu "Photonic switching network with VCSEL array packaging for parallel multiprocessor cluster system", Proc. SPIE 4997, Photonics Packaging and Integration III, (30 May 2003); https://doi.org/10.1117/12.475466
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