Analysis of critical dimension uniformity for Step and Flash imprint lithography

David P. Mancini; Kathleen A. Gehoski; William J. Dauksher; Kevin J. Nordquist; Douglas J. Resnick; Philip Schumaker; Ian McMackin

doi:10.1117/12.484923

16 June 2003 Analysis of critical dimension uniformity for Step and Flash imprint lithography

David P. Mancini, Kathleen A. Gehoski, William J. Dauksher, Kevin J. Nordquist, Douglas J. Resnick, Philip Schumaker, Ian McMackin

Author Affiliations +

Proceedings Volume 5037, Emerging Lithographic Technologies VII; (2003) https://doi.org/10.1117/12.484923
Event: Microlithography 2003, 2003, Santa Clara, California, United States

Abstract

Step and Flash Imprint Lithography (SFIL) is one of several new nano-imprint techniques being actively developed. While SFIL has been shown to be capable of sub-30 nm resolution, critical dimension (CD) control of imprinted features must be demonstrated if SFIL Is to become a viable and production worthy lithography technique. In the current study, a Molecular Imprints Imprio-100 system was used to imprint resolution patterns on 200 mm wafers. A characterization of critical dimension uniformity over the all-quartz template was done and compared to the same features printed on wafers. This analysis was performed for 100, 80, 50, and 30 nm features in three ways: over a single die using 64 sites arrayed across a 21 mm field, from field-to-field for 37 die across a single wafer, and from wafter-to-wafer for six wafers. Results show that CD's transfer from template to wafer with a slight positive bias which is greatest for 50 and 30 nm line sizes. Feature profiles studies. Despite this, the maximum calculated component of process variation from the SFIL process itself was calculated to be only 6 nm.

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David P. Mancini, Kathleen A. Gehoski, William J. Dauksher, Kevin J. Nordquist, Douglas J. Resnick, Philip Schumaker, and Ian McMackin "Analysis of critical dimension uniformity for Step and Flash imprint lithography", Proc. SPIE 5037, Emerging Lithographic Technologies VII, (16 June 2003); https://doi.org/10.1117/12.484923

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