Paper
16 June 2003 Defect repair for extreme-ultraviolet lithography (EUVL) mask blanks
Author Affiliations +
Abstract
The development of defect-free reticle blanks is an important challenge facing the commercialization of extreme ultraviolet lithography (EUVL). The basis of an EUVL reticle are mask blanks consisting of a substrate and a reflective Mo/Si multilayer. Defects on the substrate or defects introduced during multilayer deposition can result in critical phase and amplitude defects. Amplitude- or phase-defect repair techniques are being developed with the goal to repair many of these defects. In this paper we discuss the selection of a capping layer for amplitude-defect repair, and report on experimental results of the reflectance variation over the amplitude-defect repair zone for different capping layers. Our results suggest that carbon and silicon carbide are the leading candidates for capping layer materials. We further performed a quantitative assessment of the yield improvement due to defect repair. We found that amplitude- and phase-defect repair have the potential to significantly improve mask blank yield, and that yield can be maximized by increasing the number of Mo/Si bilayers.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Stefan P. Hau-Riege, Anton Barty, Paul B. Mirkarimi, Daniel Gorman Stearns, Henry N. Chapman, Donald W. Sweeney, W. Miles Clift, Eric Gullikson, and Moon-Suk Yi "Defect repair for extreme-ultraviolet lithography (EUVL) mask blanks", Proc. SPIE 5037, Emerging Lithographic Technologies VII, (16 June 2003); https://doi.org/10.1117/12.484729
Lens.org Logo
CITATIONS
Cited by 4 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Reflectivity

Photomasks

Extreme ultraviolet lithography

Silicon carbide

Multilayers

Carbon

Silicon

RELATED CONTENT

Lifetime of EUVL masks as a function of degree of...
Proceedings of SPIE (March 27 2008)
Impact of mask absorber on EUV imaging performance
Proceedings of SPIE (May 15 2010)
Mask technology for EUV lithography
Proceedings of SPIE (April 23 1999)

Back to Top