Open Access Paper
16 June 2003 Imprint lithography: lab curiosity or the real NGL
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Abstract
The escalating cost for Next Generation Lithography (NGL) tools is driven in part by the need for complex sources and optics. The cost for a single NGL tool could exceed $50M in the next few years, a prohibitive number for many companies. As a result, several researchers are looking at low cost alternative methods for printing sub-100 nm features. In the mid-1990s, several resarech groups started investigating different methods for imprinting small features. Many of these methods, although very effective at printing small features across an entire wafer, are limited in their ability to do precise overlay. In 1999, Willson and Sreenivasan discovered that imprinting could be done at low pressures and at room temperatures by using low viscosity UV curable monomers. The technology is typically referred to as Step and Flash Imprint Lithography. The use of a quartz template enabled the photocuring process to occur and also opened up the potential for optical alignment of teh wafer and template. This paper traces the development of nanoimprint lithography and addresses the issues that must be solved if this type of technology is to be applied to high-density silicon integrated circuitry.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Douglas J. Resnick, William J. Dauksher, David P. Mancini, Kevin J. Nordquist, Todd C. Bailey, Stephen C. Johnson, Nicholas A. Stacey, John G. Ekerdt, C. Grant Willson, S. V. Sreenivasan, and Norman E. Schumaker "Imprint lithography: lab curiosity or the real NGL", Proc. SPIE 5037, Emerging Lithographic Technologies VII, (16 June 2003); https://doi.org/10.1117/12.490126
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CITATIONS
Cited by 23 scholarly publications.
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KEYWORDS
Etching

Lithography

Semiconducting wafers

Silicon

Chromium

Nanoimprint lithography

Image processing

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