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16 June 2003 The EUV program at ASML: an update
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Abstract
With the realization of the α-tool, ASML is progressing with the pre-commercialization phase of its EUVL development. We report on the progress in the development of several key modules of the α-tool, including the source, wafer stage and reticle stage, wafer handling, baseframe, and optics modules. We demonstrate that the focus sensor meets its vacuum requirements, and that both stages after limited servo optimization approach the required scanning performance. A particle detection system has been built for the qualification of the reticle handling module, and preliminary results show that 50nm particles can be detected. The optics lifetime program showed substantial progress by utilizing caplayers to MoSi samples in order to suppress oxidation caused by H2O molecules under EUV illumination: a suppression ≥ 100x is achieved, compared to uncapped MoSi.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hans Meiling, Vadim Banine, Peter Kuerz, Brian D. Blum, Gert Jan Heerens, and Noreen Harned "The EUV program at ASML: an update", Proc. SPIE 5037, Emerging Lithographic Technologies VII, (16 June 2003); https://doi.org/10.1117/12.483706
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