12 June 2003 Monitoring of photo-resist poisoning
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Resist poisoning is one of the key issues linked to low-k dielectric and copper integration. This phenomenon tends to be amplified in dual damascene architecture, where both processes and materials are incriminated, especially when porous low-k dielectrics are integrated. In this paper we present and implement the dose to clear compensation method, easily undertaken with standard lithography and metrology tools, to evaluate quantitatively 248 and 193nm photo-resist poisoning on both MSQ and porous MSQ substrates. We show the amplification of resist poisoning due to the reservoir effect in porous MSQ, and address the role of the porosity in the phenomenon. We demonstrate the efficiency of the method in evaluating hard masks compatibility, wet and dry stripping processes, and its ability in screening photo-resist in term of poisoning sensitivity.
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Julia Simon, Julia Simon, Francois Weisbuch, Francois Weisbuch, Yves Quere, Yves Quere, Olivier Louveau, Olivier Louveau, Christine Bourlot, Christine Bourlot, "Monitoring of photo-resist poisoning", Proc. SPIE 5039, Advances in Resist Technology and Processing XX, (12 June 2003); doi: 10.1117/12.485091; https://doi.org/10.1117/12.485091

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