Paper
26 June 2003 Impact of scanner illumination mode on CD control process margin
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Abstract
Conventional and annular illumination modes for a 248 nm DUV scanner will be discussed in this paper for their advantage and drawbacks in critical dimension (CD) control. This includes proximity of line width through pitch size, marginality of resist profile measured as sidewall angle, depth of focus (DOF) in line width variation across field/wafer, and isolated space resolution, supported by SEM and scatterometer metrology. Both illumination modes have been applied in the current technology node with sub-wavelength CD, variable pitch sizes, optical proximity correction (OPC) for resolution enhancement and process control optimization. Each illumination defines process margin in exposure, focus and CD uniformity, to gain capability with improved CD control.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Shangting F. Detweiler, Sandra Zheng, and Mark A. Boehm "Impact of scanner illumination mode on CD control process margin", Proc. SPIE 5040, Optical Microlithography XVI, (26 June 2003); https://doi.org/10.1117/12.485429
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KEYWORDS
Critical dimension metrology

Process control

Optical proximity correction

Semiconducting wafers

Scanners

Photoresist processing

Reticles

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