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10 July 2003 Assessing technology options for 65-nm logic circuits
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The 2001 ITRS roadmap identified the need for tight coupling of design technology with manufacturing technology in order to ensure the successful production of circuits fabricated at the 65nm technology node. The design creation process for 65nm needs to efficiently explore the interaction between device, cell design and manufacturability. Using fast simulation tools for device and lithography simulation and an automated tool for standard cell generation, various process and cell architectural options were investigated. The average and standard deviation of line width had to be matched to the type of application because of the direct relationship between leakage current and performance. Best process latitude for poly line widths is achieved with Full Phase technology. It is shown that by matching design rules to the Full Phase capabilities and using automated layout tools, manufacturabilty could be optizmed without hurting density or performance.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dipankar Pramanik, Michel L. Cote, Kevin Beaudette, and Valery Axelrad "Assessing technology options for 65-nm logic circuits", Proc. SPIE 5042, Design and Process Integration for Microelectronic Manufacturing, (10 July 2003);

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