CONFERENCE PROCEEDINGS
Advanced Search
Home > Proceedings > Volume 5045 > Article
Open Access Paper
22 July 2003 Evaluating microdefect structures by AFM-based deformation measurement
Dietmar Vogel, Juergen Keller, Astrid Gollhardt, Bernd Michel
Author Affiliations +
Proceedings Volume 5045, Testing, Reliability, and Application of Micro- and Nano-Material Systems; (2003) https://doi.org/10.1117/12.483826
Event: NDE for Health Monitoring and Diagnostics, 2003, San Diego, California, United States
Abstract
The rapid development of a wide variety of new devises in microelectronics, MEMS, NEMS and nano technology will lead to new challenges for their mechanical characterization and reliability assessment. Measurement of deformations and stresses in microscopic and even nanoscopic regions becomes a key issue. The authors make use of load state images captured by Atomic Force Microscopes (AFM) in order to measure object deformations. Out-of-plane deformation is determined from usual topography scans by computing surface profile differences. NanoDAC, a recently established approach, allows to meet these goals with regard to in-plane deformation. The method bases on cross correlations analysis performed on AFM scans, which are captured from thermally and/or mechanically loaded samples. Finally, local 3D displacement fields and in-plane strain fields are measured. A description of the basic principles and the capability of the technique are given. Furthermore, the authors demonstrate the potential of the mentioned method by its application to microcrack evaluation and the study of sensor and MEMS structure degradation. The first application corresponds to the measurement of crack opening displacement in the very vicinity of crack tips. As a consequence, fracture mechanics parameters are derived and allow to assess the defect with regard to possible crack propagation and component failure. This approach is used to study the influence of nanoscale material structures on crack behavior. The second example illustrates how the impact of thermal loading to the constitution of sensor or MEMS submicron layers is investigated by deformation analysis. The devices had been heated actively under the AFM. Degradation processes due to a severe thermal material mismatch were observed and monitored.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation Download Citation
Dietmar Vogel, Juergen Keller, Astrid Gollhardt, and Bernd Michel "Evaluating microdefect structures by AFM-based deformation measurement", Proc. SPIE 5045, Testing, Reliability, and Application of Micro- and Nano-Material Systems, (22 July 2003); https://doi.org/10.1117/12.483826
PROCEEDINGS
 12 PAGES
DOWNLOAD PAPER SAVE TO MY LIBRARY
GET CITATION
Lens.org Logo
CITATIONS
Cited by 11 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Atomic force microscopy
Microelectromechanical systems
Sensors
Photomicroscopy
Scanning electron microscopy
Image resolution
Mechanics
RELATED CONTENT
Subscribe to Digital Library
Receive Erratum Email Alert
Back to Top