Paper
29 April 2003 Non-destructive test of multiply plywood using ESSPI with wide audio-frequency driving vibration
Baohui Liu, Yunwen Qin, Ri Qu, Zhende Hou, Jin-Long Chen, Xinhua Ji
Author Affiliations +
Proceedings Volume 5058, Optical Technology and Image Processing for Fluids and Solids Diagnostics 2002; (2003) https://doi.org/10.1117/12.509771
Event: Optical Technology and Image Processing for Fluids and Solids Diagnostics 2002, 2002, Beijing, China
Abstract
In this paper, the technique of electronic sheraing speckle pattern interferometry with wide Audio-frequency driving vibration is used in non-destructive test of the multiply plywood structure. Test results show that we are able to evaluate promply the soundness of bonding of the plywood. In the process of test not only can we find any locations of defects from the synthesized intensity map very quickly, but also can obtain the shape, size and resonant frequency of every interior defect of the multiply plywood accurately.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Baohui Liu, Yunwen Qin, Ri Qu, Zhende Hou, Jin-Long Chen, and Xinhua Ji "Non-destructive test of multiply plywood using ESSPI with wide audio-frequency driving vibration", Proc. SPIE 5058, Optical Technology and Image Processing for Fluids and Solids Diagnostics 2002, (29 April 2003); https://doi.org/10.1117/12.509771
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