Fundamental properties of 3D microfabrication using a femtosecond laser

Mikio Yamanoi; Satoshi Wada; Masahiro Anzai; Hitoshi Ohmori; Akitake Makinouchi

doi:10.1117/12.540604

18 November 2003 Fundamental properties of 3D microfabrication using a femtosecond laser

Mikio Yamanoi, Satoshi Wada, Masahiro Anzai, Hitoshi Ohmori, Akitake Makinouchi

Proceedings Volume 5063, Fourth International Symposium on Laser Precision Microfabrication; (2003) https://doi.org/10.1117/12.540604
Event: Fourth International Symposium on Laser Precision Microfabrication, 2003, Munich, Germany

Abstract

Micro scaled grooves and cavities are fabricated with the method of direct writing and superposing grooving in ambient air using femtosecond laser pulses and copper, aiming at establishing an industrially useful femtosecond laser processing machine to be able to fabricate three dimensional micro-scale structures, especially micro scaled molds, and processing techniques. The following items are demanded to make femtosecond laser processing machine an industrially useful tool. (1) There is no thermally influenced region around the area irradiated by the laser beam. (2) Surfaces irradiated laser beam are smooth. (3) Substances ablated to form are not attached on the surface of the work. In this study, fundamental properties of grooving and cavity processing are investigated experimentally, considering above items, especially eyeing on the items (1) and (2). As a result obtained in this research, the method of direct writing and superposing grooving havs a potential to fabricate micro scaled structure.

Citation Download Citation

Mikio Yamanoi, Satoshi Wada, Masahiro Anzai, Hitoshi Ohmori, and Akitake Makinouchi "Fundamental properties of 3D microfabrication using a femtosecond laser", Proc. SPIE 5063, Fourth International Symposium on Laser Precision Microfabrication, (18 November 2003); https://doi.org/10.1117/12.540604

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KEYWORDS

Femtosecond phenomena

Microfabrication

Laser irradiation

Copper

Laser ablation

Fabrication

Laser processing

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