23 September 2003 IR laser welding of thin polymer films as a fabrication method for polymer MEMS
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Proceedings Volume 5067, Saratov Fall Meeting 2002: Laser Physics and Photonics, Spectroscopy, and Molecular Modeling III; Coherent Optics of Ordered and Random Media III; (2003) https://doi.org/10.1117/12.518600
Event: Saratov Fall Meeting 2002 Laser Physics and Photonics, Spectroscopy, and Molecular Modeling III; Coherent Optics of Ordered and Random Media III, 2002, Saratov, Russian Federation
Abstract
MEMS (Micro Electro-Mechanical Systems) continue to be something of a solution looking for a problem. Even as the glamour has moved on to the smaller realm of nano technologies and devices, progress continues towards making micro-scale devices more useful and manufacturable. One avenue this work is taking is into the realm of polymer MEMS, shifting from the expensive, complicated methods of semiconductor processing to the much simpler methods of plastics processing. Polymeric materials are rugged, lightweight and low cost, and their use in manufacturing has a long history. While many bulk polymer manufacturing processes such as molding, machining and adhesive bonding are adaptable to the micro realm, their use in MEMS devices often requires development of specialized processing methods. Here we report on development of laser welding as a bonding method for thin polymer films, including automation of the welding process, steps towards standardization of that process, preparation of standardized test samples, and development of specialized test methods used to evaluate the strength of polymer welds. Our initial results show a direct correlation between welding parameters and weld strengths.
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William A. Beck, Michelle Huang, Joe Ketterl, Thayer Hughes, "IR laser welding of thin polymer films as a fabrication method for polymer MEMS", Proc. SPIE 5067, Saratov Fall Meeting 2002: Laser Physics and Photonics, Spectroscopy, and Molecular Modeling III; Coherent Optics of Ordered and Random Media III, (23 September 2003); doi: 10.1117/12.518600; https://doi.org/10.1117/12.518600
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