3D Imaging/Ladar
Proc. SPIE 5074, InGaAs/InP avalanche photodiode arrays for eye-safe three-dimensional imaging, 0000 (10 October 2003); doi: 10.1117/12.486325
Proc. SPIE 5074, Low-cost 3D vision for autonomous vehicles, 0000 (10 October 2003); doi: 10.1117/12.487213
Proc. SPIE 5074, High-gain 0.8-um CMOS readout integrated circuit for FM/CW line-imaging ladar, 0000 (10 October 2003); doi: 10.1117/12.488177
Infrared in Strategic Defense
Proc. SPIE 5074, MDA IR sensor technology program and applications, 0000 (10 October 2003); doi: 10.1117/12.485697
Toward Third-Generation Thermal Imagers I
Proc. SPIE 5074, Challenges for third-generation cooled imagers, 0000 (10 October 2003); doi: 10.1117/12.501269
Proc. SPIE 5074, Megapixel HgCdTe MWIR focal plane array with a 15-um pitch, 0000 (10 October 2003); doi: 10.1117/12.486880
Proc. SPIE 5074, State of the art in large-format IR FPA development at CMC Electronics, Cincinnati, 0000 (10 October 2003); doi: 10.1117/12.487644
Proc. SPIE 5074, Status of third-generation focal plane array IR detection modules at AIM, 0000 (10 October 2003); doi: 10.1117/12.488020
Proc. SPIE 5074, Large-format and multispectral QWIP infrared focal plane arrays, 0000 (10 October 2003); doi: 10.1117/12.501272
Cooled FPAs and Applications I
Proc. SPIE 5074, HgCdTe focal plane array cost modeling, 0000 (10 October 2003); doi: 10.1117/12.485635
Proc. SPIE 5074, Advanced HgCdTe focal plane arrays, 0000 (10 October 2003); doi: 10.1117/12.485908
Proc. SPIE 5074, Implementation and measurement of gamma radiation on IR photodetectors HgCdTe IRCMOS, 0000 (10 October 2003); doi: 10.1117/12.486307
Proc. SPIE 5074, Digital cooled InSb detector for IR detection, 0000 (10 October 2003); doi: 10.1117/12.498154
Proc. SPIE 5074, AIM image processing electronics for FPA IR detection modules, 0000 (10 October 2003); doi: 10.1117/12.488023
Cooled FPAs and Applications II
Proc. SPIE 5074, HgCdTe HDVIP detectors and FPAs for strategic applications, 0000 (10 October 2003); doi: 10.1117/12.487313
Proc. SPIE 5074, Composite substrate for large-format HgCdTe IRFPA, 0000 (10 October 2003); doi: 10.1117/12.487725
Proc. SPIE 5074, Silicon for visible-to-VLWIR photon detection, 0000 (10 October 2003); doi: 10.1117/12.487290
Proc. SPIE 5074, Key performance drivers for cooled large IR staring arrays, 0000 (10 October 2003); doi: 10.1117/12.497372
Proc. SPIE 5074, 4-µm cut-off MOVPE Hg1-xCdxTe hybrid arrays with near-BLIP performance at 180K, 0000 (10 October 2003); doi: 10.1117/12.487595
Proc. SPIE 5074, Type-II superlattice photodiodes: an alternative for VLWIR detection, 0000 (10 October 2003); doi: 10.1117/12.488437
Proc. SPIE 5074, Adaptive denoising at infrared wireless receivers, 0000 (10 October 2003); doi: 10.1117/12.486354
Signal Processing In and Behind the FPA
Proc. SPIE 5074, Design of a 12-megapixel imager with a nanowatt A/D converter at each pixel, 0000 (10 October 2003); doi: 10.1117/12.492941
Proc. SPIE 5074, Real-time processing and hard disk storage of high-bandwidth IR FPA data streams, 0000 (10 October 2003); doi: 10.1117/12.498472
Proc. SPIE 5074, Pixel fusion and superresolution for Matis handheld thermal imager, 0000 (10 October 2003); doi: 10.1117/12.497131
Proc. SPIE 5074, Scene-based correction of image sensor deficiencies, 0000 (10 October 2003); doi: 10.1117/12.486918
Toward Third-Generation Thermal Imagers II
Proc. SPIE 5074, Imaging spectropolarimetry, 0000 (10 October 2003); doi: 10.1117/12.501275
Proc. SPIE 5074, Microscale waveplates for polarimetric infrared imaging, 0000 (10 October 2003); doi: 10.1117/12.487887
Proc. SPIE 5074, Multisensor image fusion and mining in a COTS exploitation environment, 0000 (10 October 2003); doi: 10.1117/12.497424
Proc. SPIE 5074, Bio-inspired optics, 0000 (10 October 2003); doi: 10.1117/12.501527
Proc. SPIE 5074, Operation and performance of a color image sensor with layered photodiodes, 0000 (10 October 2003); doi: 10.1117/12.498557
SWIR FPAs and Their Applications
Proc. SPIE 5074, Characterization and analysis of InGaAsSb detectors, 0000 (10 October 2003); doi: 10.1117/12.486345
Proc. SPIE 5074, High-resolution extended NIR camera, 0000 (10 October 2003); doi: 10.1117/12.488517
Proc. SPIE 5074, Miniaturized 320x256 indium gallium arsenide SWIR camera for robotic and unmanned aerial vehicle applications, 0000 (10 October 2003); doi: 10.1117/12.486329
Proc. SPIE 5074, Application needs and trade-offs for short-wave infrared detectors, 0000 (10 October 2003); doi: 10.1117/12.497378
Proc. SPIE 5074, Dual-mode FPA for free space communications, 0000 (10 October 2003); doi: 10.1117/12.486328
Uncooled FPAs and Their Applications I
Proc. SPIE 5074, Selection of the thermal imaging approach for the XM29 combat rifle fire control system, 0000 (10 October 2003); doi: 10.1117/12.497421
Proc. SPIE 5074, 320x240 uncooled microbolometer 2D array for radiometric and process control applications, 0000 (10 October 2003); doi: 10.1117/12.488385
Proc. SPIE 5074, Resolution and sensitivity improvements for VOx microbolometer FPAs, 0000 (10 October 2003); doi: 10.1117/12.487657
Proc. SPIE 5074, Performance of 320x240 uncooled bolometer-type infrared focal plane arrays, 0000 (10 October 2003); doi: 10.1117/12.499259
Proc. SPIE 5074, Low-cost uncooled infrared detector arrays in standard CMOS, 0000 (10 October 2003); doi: 10.1117/12.488185
Proc. SPIE 5074, Portable thermographic camera development incorporating an AC-coupled ferroelectric focal plane array, 0000 (10 October 2003); doi: 10.1117/12.488263
Proc. SPIE 5074, Small two-dimensional and linear arrays of polycrystalline SiGe microbolometers at IMEC-XenICs, 0000 (10 October 2003); doi: 10.1117/12.487084
Proc. SPIE 5074, The universal toolbox thermal imager, 0000 (10 October 2003); doi: 10.1117/12.488008
Uncooled FPAs and Their Applications II
Proc. SPIE 5074, Uncooled focal plane array detector development at InfraredVision Technology Corp., 0000 (10 October 2003); doi: 10.1117/12.487455
Proc. SPIE 5074, Improvements in state-of-the-art uncooled microbolometer system performance based on volume manufacturing experience, 0000 (10 October 2003); doi: 10.1117/12.487903
Proc. SPIE 5074, Low-cost amorphous-silicon-based 160x120 uncooled microbolometer 2D array for high-volume applications, 0000 (10 October 2003); doi: 10.1117/12.488383
Proc. SPIE 5074, Microbolometer development and production at Indigo Systems, 0000 (10 October 2003); doi: 10.1117/12.487317
Proc. SPIE 5074, Recent advances in TEC-less uncooled FPA sensor operation, 0000 (10 October 2003); doi: 10.1117/12.487361
Proc. SPIE 5074, Uncooled micromachined bolometer arrays on flexible substrates, 0000 (10 October 2003); doi: 10.1117/12.487293
Proc. SPIE 5074, Advances in uncooled technology at BAE SYSTEMS, 0000 (10 October 2003); doi: 10.1117/12.488233
Proc. SPIE 5074, Advances in uncooled systems applications, 0000 (10 October 2003); doi: 10.1117/12.487646
Proc. SPIE 5074, Addressing the challenges of thermal imaging for firefighting applications, 0000 (10 October 2003); doi: 10.1117/12.497535
Proc. SPIE 5074, SCC500: next-generation infrared imaging camera core products with highly flexible architecture for unique camera designs, 0000 (10 October 2003); doi: 10.1117/12.488193
Uncooled FPAs and Their Applications I
Proc. SPIE 5074, High-sensitivity uncooled microcantilever infrared imaging arrays, 0000 (10 October 2003); doi: 10.1117/12.497576
Uncooled MWIR FPAs
Proc. SPIE 5074, Polycrystalline PbSe x-y addressed uncooled FPAs, 0000 (10 October 2003); doi: 10.1117/12.485845