21 August 2003 Three-dimensional ladar focal plane array development at Rockwell Scientific: an update
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We have developed a three-dimensional (3D) imaging ladar focal plane array (FPA) for military and commercial applications. The FPA provides snap-shot, direct detection, high-resolution range and range-sampled intensity imaging capability on a single chip. The FPA is made of a 64x64 element, 100-μm pixel pitch detector array that is directly bump bonded to a matched CMOS based silicon readout integrated circuit (ROIC) with parallel ladar signal processing at each pixel. A room temperature, SWIR InGaAs detector variant for imaging near 1.5-μm wavelengths and a cooled MWIR HgCdTe detector variant for imaging near 3-μm to 5-μm wavelengths have been fabricated. We have built a prototype SWIR FPA, integrated it to a compact, transportable SWIR flash ladar transceiver, and collected initial range images outdoors. We present the measured performances of the detector, the readout, and the image data collected with the focal plane array.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mohan Vaidyanathan, Song Xue, Kenneth Johnson, John Blackwell, Majid Zandian, Benji Hanyaloglu, Lester Kozlowski, Gary Hughes, John Montroy, Kadri Vural, "Three-dimensional ladar focal plane array development at Rockwell Scientific: an update", Proc. SPIE 5086, Laser Radar Technology and Applications VIII, (21 August 2003); doi: 10.1117/12.487211; https://doi.org/10.1117/12.487211


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